Call for Papers

NEMO 2018 brings together experts and practitioners of electromagnetic- and multiphysics-based modeling, simulation and optimization for RF, microwave and terahertz applications. This conference is an ideal forum to share new ideas on techniques for electromagnetic and multiphysics modeling, propose efficient design algorithms and tools, and anticipate modeling/analysis needs of future technologies and applications. Papers using numerical or multi-physics computational methods in unique ways for microwave component or system analysis are encouraged.

Founded by the IEEE Microwave Theory and Techniques Society (MTT-S), NEMO is a new annual focal event on electromagnetic- and multiphysics-based computer-aided design (EM-CAD), rotating between Europe, North America and Asia. NEMO 2018 aims to stimulate discussion and exploration of “disruptive” technologies of EM-CAD in addition to traditional topics. The conference features an exciting technical program, an industry exhibition and invited talks by internationally recognized experts in electromagnetic and multiphysics modeling and optimization.

Conference Topics

Authors are cordially invited to submit papers in all areas of electromagnetic modeling, analysis and optimization, including but not limited to: 

  • Computational electromagnetics
  • Computation multiphysics and modeling
  • Analytical and semi-analytical modeling
  • Integral equation methods
  • Finite difference methods
  • Finite element methods
  • Hybrid modeling techniques
  • Frequency-domain methods
  • Time-domain methods
  • High-frequency methods
  • Multi-scale modeling techniques
  • Large-scale problems
  • Parallel computing
  • Computer-aided design and techniques
  • Cognition-aided design
  • Modeling of active devices and circuits
  • Evolutionary classical optimization techniques
  • Space mapping methodologies
  • Medical image signal processing techniques
  • Inverse electromagnetic problems
  • Fifth-generation mobile system analysis and modeling
  • Modeling of IC packages and interconnections
  • Signal and power integrity optimization
  • Modeling of biological effects
  • Modeling of electro/optical devices
  • Terahertz circuit and modeling
  • New materials and nanostructures modeling
  • New and emerging areas

Submitted papers should be 3-4 pages in length. Authors must adhere to the format provided in the paper template available in the conference site.

Important Dates

Preliminary Paper Submission Deadline:
March 15, 2018
Notification of Acceptance: May 15, 2018
Final Paper Submission: June 5, 2018
Conference Date: August 8-10, 2018

 

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