Invited Paper Track

Submit your papers here and select the topic of Invited Papers.
Open on 3/15/2020.

Call for Papers

NEMO2020 brings together experts and practitioners of electromagnetics- and multiphysics-based modeling, simulation, optimization and design for RFIC, 3DIC, SiP, Terahertz Electronics, Nanoelectronics, Nanophotonics, 5G wireless communication, and other applications. This conference is an ideal forum to share new ideas on modeling and design for electromagnetics and multiphysics, propose efficient design algorithms, tools, routes, strategies, and anticipate the modeling/analysis/optimization needs of future technologies and applications. Papers using analytical, semi-analytical, and numerical methods or design routes in unique ways for electromagnetic structures, components, devices or system analyses or applications are encouraged.

Founded by the IEEE Microwave Theory and Techniques Society (MTT-S), NEMO is an annual focal event on electromagnetics- and multiphysics-based modeling, simulation, high performance computing, and design for microwave, antennas & propagation, and electromagnetic compatibility (MAPE), rotating between Europe, North America and Asia. NEMO2020 aims to stimulate broad discussion and exploration of disruptive technologies of EM-CAD in addition to traditional topics. The conference features an exciting technical program, an industry exhibition and invited talks by internationally recognized experts in electromagnetic and multiphysics modeling, simulation and optimization.

Conference Topics

Authors are cordially invited to submit papers in all areas of electromagnetic and multiphysics modeling, analysis and optimization, including but not limited to:

ü Modeling, simulation and design for MTT/AP/EMC

ü EM reliability of devices and circuits

ü Computational electromagnetics

ü Modeling and simulation of HPM effects

ü Multiphysics modeling, simulation and design

ü Modeling and simulation of E3

ü Computational nanoelectronics

ü 2D material device modeling and design

ü Semi-analytical modeling and simulation

ü Interconnect modeling and design

ü Integral equation methods

ü System-on-chip modeling and design

ü Finite difference/Finite element methods

ü 3DIC, Aip and SiP modeling and design

ü Hybrid simulation techniques

ü Ultra-fast electronics device modeling

ü Frequency-domain methods

ü Cognition-aided design

ü Time-domain methods

ü Modeling of active devices and circuits

ü High-frequency methods

ü Power electronics device modeling

ü High performance CEM and applications

ü Space mapping optimization techniques

ü High performance computational multiphysics

ü Inverse electromagnetic problems

ü EDA and CAD techniques

ü 5G mobie system analysis and modeling

ü Machine learning algorithms

ü Signal integrity analysis

ü Artificial neural network modeling and optimization

ü Modeling of biological effects

ü Neural computation and applications

ü Modeling of nanophotonic devices

ü Metastructure simulation and applications

ü Modeling of THz Devices and Circuits

ü EMC for circuit and system designs

ü New EM materials modeling and simulation

ü New and emerging areas

Paper Format

  • Full paper, 3 pages in length, presentation and publication in IEEE Xplore.
  • Abstract, 1 page, presentation only.
  • Full papers must adhere to the format of the IEEE conference paper template.

Important Dates

  • Submission deadline: March 15, 2020
  • Notification of Acceptance: May 5, 2020
  • Final Paper Submission: June 5, 2020
  • Conference Date: August 1-3, 2020

Download the PDF Version of Call for Papers